Applicable to 01005, 0201, ✘  0402/, CSP, uBGA, QFP and€∑↔  other Fine Pitch lead↓©-free solder paste printing are th≈←‌e best choices, which can significan↔¥δ$tly reduce poor printing ₩ such as solder beads, insufficient sol©γ₽der, and empty solder;

Especially suitable for σ large-scale SMT printing, it can ma≤♠γ↓intain a high yield rate.

◆ Technical indicators:

Hole size accuracy: ± 0.005$α mm

Maximum positional deviation: ± 0.010 ​↔σmm

Thickness error: ± 0.005 mm

Hole wall roughness:< 0☆£ε.0003 mm

Nickel alloy hardnes ≤∑s: 500 ~ 560 Hv

◆ Features:

Smooth hole walls and conical cross♠ γ-sections are advantageous for s₹σolder paste demolding; Electroformed✘ γ nickel alloy has a low¶✘ surface energy level, red↔≠€☆ucing solder paste adhe♠↑sion;

The surface hardness can׶×✘ reach 500~560HV, which exte>♠ nds the service life of the≥↕ template;

According to customer require'φ™ments, templates with ₩∏ a thickness of 20-300um &"can be provided; STEP DOWN/STEP÷✔→♥ UP suitable for connectors and other δφγπspecial requirements.